Ranging from 30 nm to 80 nm, ND®Silver powders and platelets (500 nm) are used in a variety of applications. For printed electronics, NDSilver offers unique stability at elevated temperatures and does not exhibit room temperature sintering and migration. These materials have been engineered for increased electrical conductivity in low-temperature processing scenarios, including printing on paper and polymer substrates. With customized surface chemistries for a variety of conductive inks and adhesives, NDSilver materials provide numerous benefits in printed electronics applications, including fine-line print definition and stringent rheology control via closely manipulated particle size distributions. Due to highly concentrated properties at thin coating levels, NDSilver also reduces the amount of material required.

NDSilver nanoparticles also enhance resistance to the growth of bacteria, mold and mildew for a broad range of antimicrobial products in the healthcare, industrial and consumer markets. Ideal applications include those where exposure to moisture is high, where hygiene and infection-control are required, and where the potential for bacterial, mold and mildew growth affects long-term product integrity.

NDSilver materials are available as dry powders or in wet raw material “pre-dispersions” for ease of handling and dispersion into the applicable product or system.